Contract Awarded For High-density Plasma Chemical Vapor Deposition 1set
high-density Plasma Chemical Vapor Deposition Shanghai Huali Microelectronics Corporation
2026-04-09 10:00 2026-04-10 10:52 - 2026-04-13 23:59 2026-04-24 15:39.high-density Plasma Ch
TK ID 528684576
Document Type
Contract Awards
Tender Summary
Contract Awarded For High-density Plasma Chemical Vapor Deposition 1set
high-density Plasma Chemical Vapor Deposition Shanghai Huali Microelectronics Corporation
2026-04-09 10:00 2026-04-10 10:52 - 2026-04-13 23:59 2026-04-24 15:39.high-density Plasma Ch
Action Deadline
24 Jul 2026