Document Type

Contract Awards

Tender Summary

Contract Awarded For 0730-254010sz0145/01 Double-layer Bonding Machine nantong Shennan Circuits Co.,ltd. Project-double-layer Bonding Machine (rebid) Nantong Shennan Circuits Co.,ltd. 2025-12-25 10:00 2025-12-26 17:15 - 2025-12-29 23:59 2026-01-06 17:13.

Action Deadline

06 Apr 2026