Contract Awarded For High-precision Flip Chip Bonder
high-precision Flip Chip Bonder Project For The 49thresearch Institute Of China Electronics Technology Group Corporation The 49th Research Institute Of China Electronics Technology Group Corporation
20
TK ID 517940027
Document Type
Contract Awards
Tender Summary
Contract Awarded For High-precision Flip Chip Bonder
high-precision Flip Chip Bonder Project For The 49thresearch Institute Of China Electronics Technology Group Corporation The 49th Research Institute Of China Electronics Technology Group Corporation
20