National Contract Notice: 8" Semi-automatic Waffer Dicing Saw The Object Of The Tender Process Is Semi-automatic Wafer Dicing Saw For Min 8inch Wafers And Various Ceramic And Glass Substrates.
the Object Of The Tender Process Is Described In More Detail I
TK ID 516751748
Document Type
Contract Awards
Tender Summary
National Contract Notice: 8" Semi-automatic Waffer Dicing Saw The Object Of The Tender Process Is Semi-automatic Wafer Dicing Saw For Min 8inch Wafers And Various Ceramic And Glass Substrates.
the Object Of The Tender Process Is Described In More Detail I