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Microsystems Government Tenders

Explore the latest tenders in Microsystems. Browse procurement notices, filter the list, and track updates through the day.

Showing 361–370 of 801 tenders
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lab equipments
Medical Devices Intended Tender
S
state healthcare institution "inze district hospital"
Tender ID: 102764370 • Published: 13 Nov 2026 • Russian federation
Deadline
20 Nov 2026
5 days left
Estimated Value
N/A
other machinery lab equipments
Wafer Chip Bonding Tender
N
national university corporation
Tender ID: 102787053 • Published: 13 Nov 2026 • Japan
Deadline
21 Dec 2026
36 days left
Estimated Value
N/A
other machinery lab equipments
Wafer Chip Bonding Tender
N
national university corporation
Tender ID: 102252366 • Published: 30 Oct 2026 • Japan
Deadline
21 Dec 2026
36 days left
Estimated Value
N/A
other machinery lab equipments
Wafer Chip Bonding Tender
N
national university corporation
Tender ID: 102289461 • Published: 30 Oct 2026 • Japan
Deadline
21 Dec 2026
36 days left
Estimated Value
N/A
other machinery lab equipments
Wafer Chip Bonding Tender
N
national university corporation
Tender ID: 102333922 • Published: 01 Nov 2026 • Japan
Deadline
21 Dec 2026
36 days left
Estimated Value
N/A
other machinery lab equipments
Wafer Chip Bonding Tender
N
national university corporation
Tender ID: 102344590 • Published: 02 Nov 2026 • Japan
Deadline
21 Dec 2026
36 days left
Estimated Value
N/A
other machinery lab equipments
Wafer Chip Bonding Tender
N
national university corporation
Tender ID: 102357565 • Published: 02 Nov 2026 • Japan
Deadline
21 Dec 2026
36 days left
Estimated Value
N/A
other machinery lab equipments
Wafer Chip Bonding Tender
N
national university corporation
Tender ID: 102595563 • Published: 07 Nov 2026 • Japan
Deadline
21 Dec 2026
36 days left
Estimated Value
N/A
other machinery lab equipments
Wafer Chip Bonding Tender
N
national university corporation
Tender ID: 102649688 • Published: 10 Nov 2026 • Japan
Deadline
21 Dec 2026
36 days left
Estimated Value
N/A