Supply, installation, commissioning, providing training and delivery of one (1) set of wafer bonder system (item 1) and one (1) set of wafer cleaning system (item 2) to the division of physics & applied physics, spms, ntu
🔍 Key Information
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Tender Reference No.
102348138
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Publication Date
02 Nov 2026
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Estimated Value
N/A
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Sector
N/A
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Deadline
17 Nov 2026
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Notice Type
Tenders
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Location
Singapore
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Contract Duration
15 Days
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Documents & Downloads
No documents found
🏷️ CPV
No CPV found
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