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Semiconductor Chip Assembly Tender

πŸ›οΈ INTEL
πŸ“„ Tender ID: 495770294 πŸ“… Published: 14 Oct 2023

πŸ“‹ Tender Overview

Scope : To Build Semiconductor Chip Assembly and Testing Facility near Wroclaw, Poland

American tech giant Intel announced that it would invest $4.6 billion (18.7 billion Polish zloty) to build a new semiconductor chip assembly and testing facility near Wroclaw, Poland, as part of a multi-billion-dollar investment drive across Europe to build chip capacity.

The new facility will employ 2,000 workers and create several thousand additional jobs during the construction phase and hiring by suppliers adding to the 4,000 employees that Intel already has in Poland, including at the firm’s largest European research and development facility in Gdansk.

The facility’s design and planning will begin immediately, with construction beginning after European Commission permission and projected to be completed by 2027. The site in Poland will receive chips created on silicon wafers at the Irish and German plants, assemble them into final products, and then test them for performance and quality.


πŸ” Key Information

πŸ“„
Tender Reference No.
495770294
πŸ“…
Publication Date
14 Oct 2023
πŸ’°
Estimated Value
N/A
🌐
Sector
Industry
πŸ“…
Deadline
31 Dec 2027
πŸ“
Notice Type
Projects
πŸ“
Location
United states
πŸ“‘
Contract Duration
4 Years 2 Months 17 Days

πŸ“ Documents & Downloads

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🏷️ CPV

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πŸ•’ Submission deadline
424
days remaining Β· 31 Dec 2027
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🧭 Quick Facts

Authority INTEL
Country United states
State / UT N/A
Tender Type Project Information
Currency USD
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