Technology Hardware and Equipment Software Services

Outplaying Hardware Lottery Tender

πŸ›οΈ KATHOLIEKE UNIVERSITEIT LEUVEN
πŸ“„ Tender ID: 488888881 πŸ“… Published: 26 May 2023

πŸ“‹ Tender Overview

Outplaying the hardware lottery for embedded AI The next wave of smart applications in our society will need embedded devices (robots, wearables, etc.) with increased intelligence at much reduced energy and latency cost. Compared to current embedded platforms, up to 1000x efficiency gains could be achieved through tight processor-algorithm co-optimization. However, due to the slow development cycle of processor chips (many months to years) in comparison to algorithms (hours to weeks), this co-optimization today merely boils down to selecting algorithms which run well on mature, available hardware. As these processors and their tooling have been optimized for mature algorithms, not the inherently best algorithm wins , but the one that happens to best fit the available old-school hardware platforms. This hardware lottery holds back innovation, severely impacts embedded AI execution efficiency, and narrows the market to a few large companies.

The BINGO vision to break this innovation deadlock is to enable heterogeneous compute platform customization for a given AI workload in a matter of days (100x faster), through rapid selection and assembly of prefabricated co-processor chiplets. This needs breakthroughs in:
a.) A library of embedded-AI-optimized co-processor chiplets, surpassing the SotA in terms of dataflow heterogeneity for improved efficiency (100x over CPU); and inter-operability in heterogeneous chiplet meshes on a reusable breadboard interposer.
b.) Rapid cost models and workload schedulers for beyond-SotA heterogeneous platform customization: automatically deriving the optimal chiplet combination for an application, assemble it and deploy, all in a few days.

Optimizing across the disciplines of chip design, computer architecture, scheduling, and AI fits perfectly to my expertise gained at KU Leuven, imec and Intel. It will stimulate a surge of embedded AI innovations, enable efficient execution of new algorithms, and bring the EU back at the forefront of chip design and embedded AI research. 1 995 750 EU contribution
€ 1 995 750 Start date
1 June 2023 End date
31 May 2028

πŸ” Key Information

πŸ“„
Tender Reference No.
488888881
πŸ“…
Publication Date
26 May 2023
πŸ’°
Estimated Value
EUR 1995750
🌐
Sector
Technology Hardware and Equipment
πŸ“…
Deadline
31 May 2028
πŸ“
Notice Type
Projects
πŸ“
Location
Italy
πŸ“‘
Contract Duration
5 Years 5 Days

πŸ“ Documents & Downloads

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πŸ•’ Submission deadline
576
days remaining Β· 31 May 2028
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🧭 Quick Facts

Authority KATHOLIEKE UNIVERSITEIT LEUVEN
Country Italy
State / UT N/A
Tender Type Project Information
Currency EUR
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