laboratory equipment and services Information Technology (IT)

Igzo Smart Interposer Tender

🏛️ KATHOLIEKE UNIVERSITEIT LEUVEN
📄 Tender ID: 488888913 📅 Published: 26 May 2023

📋 Tender Overview

igzO-based smaRt Interposer technologieS fOr iNtegrated circuits and pixels Silicon complementary metal-oxide semiconductor (Si CMOS) technologies are ubiquitous in a plethora of products today employing a multitude of chips. The current challenges of Si chips research and applications are area, power consumption and high-voltage interposing for AR/VR, low-power IoT, high-voltage sensors and actuator interfaces such as MEMS and lab-on-chip.

ORISON’s goal is to develop a scalable toolbox on top of Si CMOS chip technologies for disruptive research activities in ultralow power circuit design, high-voltage interfacing and low-area 3D stacked hybrid pixel engines. The technology platform focuses on a 3D hetero-integration route of Si CMOS and Indium-Gallium-Zinc-Oxide (IGZO) n-type transistors with a 100x lower electron mobility. The game changing nature of ORISON enables innovation on three major pillars: (1) extreme low off-stage leakage currents due to the wide bandgap semiconductor, leading to ultralow power and long retention electronic circuits, (2) the absence of a bulk for IGZO devices, enabling low footprint and high-voltage devices on top of Si CMOS and (3) a 3D technology platform facilitating beyond state-of-the-art circuit and pixel resolutions.

A new hybrid Si pMOS/IGZO cell library will be pioneered targeting ultra-low power consumption because of comparable sub-threshold slopes of both technologies, low off-state leakage currents and individual tuneable threshold voltages by a local backgate. In addition, true cell-level power gating techniques are envisioned to radically reduce the idle power consumption, paving the way to lifetime battery-powered or battery-less wearables and leaf-node IoT.

The novel high-voltage hybrid library impacts positively MEMS and AR/VR applications with unprecedented footprint and power characteristics and enables technology partitioning for smart pixels. The 3D technology also envisions high-resolution pixel engines with refresh-on-demand capacitor-less pixel engines. 1 999 688 EU contribution
€ 1 999 688 Start date
1 May 2023 End date
30 April 2028

🔍 Key Information

📄
Tender Reference No.
488888913
📅
Publication Date
26 May 2023
💰
Estimated Value
EUR 1999688
🌐
Sector
laboratory equipment and services
📅
Deadline
30 Apr 2028
📝
Notice Type
Projects
📍
Location
Belgium
📑
Contract Duration
4 Years 11 Months 4 Days

📁 Documents & Downloads

View All Documents →
# Document Name Type Action
2
T488888913.html
HTML

🏷️ CPV

No CPV found

Need help with this bid?

Our bid experts can help you find, evaluate & win more tenders.

🎧 Talk to Bid Expert
🕒 Submission deadline
542
days remaining · 30 Apr 2028
🔔 Set Alert

🧭 Quick Facts

Authority KATHOLIEKE UNIVERSITEIT LEUVEN
Country Belgium
State / UT N/A
Tender Type Project Information
Currency EUR
Similar Tenders
Loading similar tenders…