Cadence Design Systems Inc. announced that its full-flow digital and signoff tools support the new high-performance high-efficiency Arm Cortex-A77 CPU for next-generation smartphones laptops and other mobile devices. To accelerate the adoption of Arms latest processor Cadence delivered a complete 7nm Rapid Adoption Kit RAK that utilizes Arm 7nm POP IP libraries enabling customers to improve power performance and area PPA and get to market faster.The 7nm RAK includes comprehensive documentation and tool scripts that detail how customers can leverage their existing Cadence full-flow digital solution using the latest tool features to achieve PPA goals when creating designs with the Cortex-A77 processor. The complete Cadence RTL-to-GDS flow includes the following digital and signoff toolsInnovus Implementation System Statistical on-chip variation SOCV propagation and IR-driven optimization results in improved timing closure and power integrity for advanced 7nm designsGenus Synthesis Solution Register-transfer level RTL physical synthesis supports all the latest 7nm advanced-node requirements resulting in convergent design closure using the Innovus Implementation SystemConformal Equivalence Checking Ensures the accuracy of logic changes and engineering change orders ECOs during the implementation flowConformal Low Power Enables the creation and validation of power intent in context of the design combining low-power equivalence checking with structural and functional checks to allow full-chip verification of power-efficient designsTempus Timing Signoff Solution Offers path-based signoff-accurate timing analysis and 7nm physically aware ECO design optimization providing the quickest path to tapeoutVoltus IC Power Integrity Solution Static and dynamic analysis used during implementation and signoff ensures optimal power distribution designQuantus Extraction Solution Fulfills all 7nm advanced-node requirements to ensure accurate correlation to final siliconThe launch of Cortex-A77 delivers a number of enhancements offering customers the performance and efficiency leadership needed for the latest smartphones laptops and other mobile devices said Ian Smythe vice president of marketing Client Line of Business at Arm. Our collaboration with Cadence on the delivery of the RAK enables partners to quickly bring optimized solutions to market across emerging applications areas like 5G augmented reality and machine learning.We worked closely with Arm to optimize our advanced digital implementation and signoff solutions for the Cortex-A77 processor so customers can create 7nm designs that meet aggressive PPA goals said Dr. Chin-Chi Teng senior vice president and general manager in the Digital Signoff Group at Cadence. Engineers using the RAK can adopt Cadence and Arm technologies with confidence that they can deliver competitive designs to market faster.
🔍 Key Information
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Tender Reference No.
444606351
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Publication Date
01 Jun 2019
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Sector
Banking, Finance, Insurance and Securities (BFIS)
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Notice Type
News
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Location
United states
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