📋 Tender Overview
Cadence Design Systems Inc. announced that it expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking broadband enterprise storage wireless and industrial applications. Building upon successful 7nm designs Cadence and Broadcom are expanding the collaboration to include the creation of 5nm designs using Cadence digital implementation solutions. With these Cadence solutions in place Broadcom can further augment engineering productivity and improve silicon performance and power.As a global infrastructure technology leader were committed to delivering innovative products that enable our customers to excel in their respective markets said Yuan Xing Lee vice president and head Central Engineering at Broadcom Inc. With Cadence as a key silicon design partner were able to achieve our power and performance goals and provide our customers with the highest quality solutions that theyve come to expect from us.Weve collaborated with Broadcom for many years and our expanded partnership on advanced-node design development is a result of the series of successes weve had together over time and our overall digital technology leadership said Dr. Anirudh Devgan president of Cadence. Given the continued proliferation of networking broadband enterprise storage wireless and industrial applications were dedicated to ensuring that Broadcom achieves design excellence using our latest toolsets to fuel design innovation.The Cadence digital implementation solutions are part of the broader digital suite which provides optimal power performance and area PPA and reduced turnaround time. The tools support Cadences Intelligent System Design strategy which enables systems and semiconductor companies to achieve system-on-chip SoC design excellence more efficiently.
