Japan Spie Photonics Tender

Kyocera the world leader in Fine Ceramics will exhibit its latest optoelectronic products and technologies Jan. 25-27 at SPIE Photonics West 2022 Booth 4314 in San Franciscos Moscone Center showcasing components that enable new innovations in communication sensing 3D imaging industry medicine and smart vehicles.Photonics West the worlds leading photonics technology event gives a global audience access to major brands startups and the industrys most influential leaders and advocates.Kyoceras cutting-edge ceramic package and optoelectronic lens solutions support the most demanding semiconductor and laser applications. Kyocera will exhibit a wide range of technologies highlighting multiple ceramic package technical approaches for autonomous driving and LIDAR module applications. The company will also show its Semiconductor Microelectronics Assembly Service capabilities supporting various markets. Kyocera experts will be available to discuss the following product and service offeringsCeramic Packages for LIDAR Applications- Ceramic Packages for Integrated FMCW Frequency-Modulated Continuous Wave modules for Level 4 and 5 autonomous driving applications- Ceramic Packages for OPA Optical Phased Array FMCW modules- Ceramic Packages for discrete modules used in ToF Time of Flight and ADAS Advanced Driver Assistance Systems devices- Open Tooled Package Tunable Lasers- SOA Semiconductor Optical Amplifier Packages- Ceramic Packages for Receivers and Detectors- Ceramic Submounts for EEL Edge Emitting Lasers- Ceramic Packages Submounts for VCSELs Vertical Cavity Surface Emitting Lasers- Ceramic Packages for MEMS MirrorsCeramic Packages Substrates for Photonic Applications- Ceramic Packages for Image Sensors SPAD and CMOS- Large Size and Low CTE Ceramic Substrates for CT Scanners Photo Diode Arrays- 3D Structural Ceramic Packages for Endoscopes- High Thermal and High-Reliability Ceramic Substrates for LED and UV-LED Lamps- Compact Ceramic Packages for MEMS Devices Gas Sensors and Gyro Sensors- Ceramic Packages for 3D Sensors IR LED and High Flexural Strength Ceramic Substrates for 3D Sensor DevicesSemiconductor Microelectronics Assembly Service Capabilities- Wirebond Assembly Including Multichip Modules MEMS 2.5D and Hybrid Assembly- Flip Chip Assembly Including Various Thermal Interface Materials for Photonics ICs Memory Devices and 2.5D Assembly- Hermetic and Non-Hermetic Solutions- High Reliability and Commercial Process Flows- Highly Engineered Solutions- Multi-level Component Sourcing SupportOptical Components- Molded Aspherical Lenses- Spherical Lenses- Plastic Lenses- Automotive Lenses- Machine-Vision Lenses- Scanner Lenses- Line-Sensor Lenses- F-Theta lenses- UV EUV and DUV ObjectivesOptical Systems- Design of System Requirements- Integration Analysis of Multiple Technology Platforms- Laser Illumination and Vision Systems- Component Fabrication and Assembly- MTF and WFE Performance Testing- Performance Optimization- Mass ProductionLasers- Solid-State and Direct Diode Laser Products- JUNO Series Serving Biotech Analytical Medical and Measuring Field Applications