Technology Hardware and Equipment

Germany Infineon Introduces Tender

📄 Tender ID: 460618253 📅 Published: 05 Mar 2021

📋 Tender Overview

Infineon Technologies AG is expanding its wireless portfolio of high-performance reliable and secure offerings. The newly developed AIROC brand now includes the industrys first 1x1 Wi-Fi 66E and Bluetooth 5.2 combo SoC for the IoT enterprise and industrial applications and its first 2x2 Wi-Fi 66E and Bluetooth 5.2 combo SoC for multimedia consumer and automotive applications. The Wi-Fi 66E combo solutions operate in the 2.4 GHz 5 GHz and the new greenfield 6 GHz spectrum to deliver robust performance and minimal latency. This makes them ideal for high-quality video and audio streaming applications like gaming consoles ARVR smart speakers media-streaming devices and automotive Infotainment. Applications that require an instant response like security systems and industrial automation will also benefit from Infineons new products.Infineons AIROC Wi-Fi 66E-certified solutions go above and beyond the standard requirements to elevate user experience with advanced wireless technology and architectural innovations that result inDouble the wireless coverage range compared to Wi-Fi 5 and Wi-Fi 440 percent more coverage than typical Wi-Fi 66E solutionsImproved connection robustness with enhanced interference mitigationLower latency and better Wi-FiBT Coexistence that improves multimedia streaming and gaming responsiveness in overlapping network environmentsOver 20 percent power savings enabling longer battery lifeMulti-layer security protections with secured boot firmware authentication and encryption and lifecycle management enabling a higher level of security for IoT applications.AIROC Wi-Fi 66E combo solutions address the challenges of congested 2.4 GHz and 5 GHz channels and bring extraordinary audio and video quality for media applications and robust long-range connections for IoT applications said Vikram Gupta Senior Vice President of Infineons IoT Compute and Wireless Business Unit.Infineons AIROC Wi-Fi 66E solutions are also equipped with the latest Bluetooth 5.2 technology enabling high-quality audio with LC3 and enabling new BLE audio use cases such as audio sharing and audio broadcast. The unique low-power Wake-on-Bluetooth LE mode allows the host CPU to conserve power while the Bluetooth core autonomously listens for incoming connection requests. Advanced wireless technology innovations have been added to improve BTBLE range robustness latency and power savings above and beyond standard BT5.2. Infineons unique Smart Coex maximizes Wi-Fi throughput when used concurrently with Bluetooth and optimizes for demanding multi-media use cases.Infineons module partners build Wi-Fi 66E integrated solutions that allow for rapid development reduced test costs and product certification. Collaborating with Infineon allows us to leverage our combined expertise to develop innovative Wi-Fi solutions which further build upon our market-leading position said Akira Sasaki General Manager of Murata. Our most recent collaboration is a Wi-Fi 66E CYW5557x module that delivers advanced technology integration superb network quality and enables fast time-to-market. Further it can be delivered through Muratas extensive sales and distribution channel.LG Innotek is excited to partner with Infineon on the new Wi-Fi 6E communication module which carries the CYW89570 chip said Insoo Ryu Vice President Automotive Components Electronics Business Division LG Innotek. This module extends LGITs automotiveindustrial product family into the next generation and brings the latest Wi-Fi 6E and Bluetooth 5.2 standards to automotive platforms.For automotive applications u-blox builds AECQ100 qualified and industrial modules with Infineons Wi-Fi 6E combo solution. At u-blox we are excited to work with Infineon on the new CYW89570 said Hakan Svegerud Senior Director Product Strategy u-blox. Based on these solutions we will extend our successful JODY module family with global automotive and industrial grade modules providing cutting edge technologies including Wi-Fi 6 Wi-Fi 6E and Bluetooth 5.2 to our customers.nFores NF3327PQ Combo module has Infineons CYW89570 chipset inside. Infineons CYW89570 chipset is the perfect chipset for enabling Wi-Fi 6 and Bluetooth 5.2 technologies for automotive customers said Mr. Yu Zongyuan CEO of nFore Technology.

🔍 Key Information

📄
Tender Reference No.
460618253
📅
Publication Date
05 Mar 2021
🌐
Sector
Technology Hardware and Equipment
📝
Notice Type
News
📍
Location
Germany

📁 Documents & Downloads

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🏷️ CPV

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🧭 Quick Facts

Authority N/A
Country Germany
State / UT N/A
Tender Type Procurement News
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