📋 Tender Overview
Contract awarded for Chemical-mechanical polishing machine lot-0001, title: chemical-mechanical polishing machine, description: the friedrich schiller university jena intends to acquire a chemical-mechanical polishing machine (cmp) for polishing semiconductor and dielectric surfaces for optical applications for its scientific activities. it must be suitable for sample sizes up to wafers (semiconductor discs) with diameters of up to 100 millimeters and be able to achieve roughnesses of less than 1 nanometer (rms roughness). the following minimum requirements arise: see annex 2. the awarding authority reserves the right to exclude bids with a total contract value exceeding 225,000.00 euros net from the evaluation. if all bids exceed this limit, the awarding authority is entitled to cancel the tender. estimated value excluding vat: 225000.00 eur.Chemical-mechanical polishing machine
